8″ – 3M 3792LMQ Low-Melt Glue Sticks 165/Case

Description

• Low-melt is applied at 265 F. to bond heat sensitive substrates such as polystyrene foam.
• Excellent “hot-tack” when dispensed at low-melt temperatures.
• Can bond expanded polystyrene, corrugated packaging and displays.
• 25 second bonding range.
• FDA listed.

XB: 8 x 8 x 2